AX9100 X-ray Inspection Equipment Key Features
High-Precision Imaging: Equipped with a 90-130kV X-ray source and a mega-level high-resolution FPD detector, it supports 1200x magnification, clearly revealing minute defects (such as solder cracks and internal bubbles).
Multi-Axis Linked Inspection: A 7-axis robotic arm with 70° tilt inspection capability enables 360°, unobstructed viewing of complex structures (such as BGA packages and flip chips).
Intelligent Analysis: Generates 2.5D images with one click, supports offline programming and AI-assisted defect detection, and automatically generates inspection reports.
Safety Protection: Complies with FDA radiation safety standards, featuring integrated lead sheet and lead glass protection.
Applications
Electronics Industry: Detects solder joint defects (such as bond balls and wedges) on packaged components such as ICs, BGAs, CSPs, and flip chips.
New Energy Industry: Analyzes lithium battery electrode solder joints, cell winding conditions, and internal defects in aluminum casings.
Industrial Manufacturing: Internal flaw detection of automotive parts (such as wheels), aluminum die-castings, ceramic products, and photovoltaic silicon wafers.
Others: Nondestructive testing of special materials such as LED modules, medical devices, and molded plastics.
Typical Applications
Semiconductor Packaging: Inspecting the bond ball and wedge weld quality of gold wire solder joints.
Automotive Parts: Real-time observation of internal pores or cracks in aluminum die-castings to determine defect levels.
AX9100 X-ray Inspection Equipment Key Features
High-Precision Imaging: Equipped with a 90-130kV X-ray source and a mega-level high-resolution FPD detector, it supports 1200x magnification, clearly revealing minute defects (such as solder cracks and internal bubbles).
Multi-Axis Linked Inspection: A 7-axis robotic arm with 70° tilt inspection capability enables 360°, unobstructed viewing of complex structures (such as BGA packages and flip chips).
Intelligent Analysis: Generates 2.5D images with one click, supports offline programming and AI-assisted defect detection, and automatically generates inspection reports.
Safety Protection: Complies with FDA radiation safety standards, featuring integrated lead sheet and lead glass protection.
Applications
Electronics Industry: Detects solder joint defects (such as bond balls and wedges) on packaged components such as ICs, BGAs, CSPs, and flip chips.
New Energy Industry: Analyzes lithium battery electrode solder joints, cell winding conditions, and internal defects in aluminum casings.
Industrial Manufacturing: Internal flaw detection of automotive parts (such as wheels), aluminum die-castings, ceramic products, and photovoltaic silicon wafers.
Others: Nondestructive testing of special materials such as LED modules, medical devices, and molded plastics.
Typical Applications
Semiconductor Packaging: Inspecting the bond ball and wedge weld quality of gold wire solder joints.
Automotive Parts: Real-time observation of internal pores or cracks in aluminum die-castings to determine defect levels.
